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Iceotope and Lenovo Partner to take HPC to the Edge

Iceotope and Lenovo Partner to take HPC to the Edge

Data CentresFacilities & ServersPower & CoolingSoftwareTop Stories

The Iceotope, Avnet and Schneider Electric partnership to jointly develop innovative, chassis-level immersion cooled data centre solutions has been joined by Lenovo to deploy its ThinkSystem SR670 servers in a highly scalable, GPU-rich, liquid-cooled Micro Data Centre solution. Sealed at chassis level, the new solution enables Artificial Intelligence (AI), Machine Learning (ML) and High Performance Computing (HPC) workloads to be deployed in close proximity to the location of data generation and use regardless of how harsh or hostile the environment.

The Lenovo ThinkSystem SR670 2U rack server delivers uncompromised HPC performance with support for up to four double-width GPUs per server. Integrating the servers with Iceotope’s Ku:l Chassis eliminates the requirement for any air cooling, delivering game-changing efficiency in energy consumption. More than 95% of the heat is captured and rejected via an in-rack Heat Rejection Unit (HRU) (5kW solution) or dedicated external HRU (46kW+ scalable solution).

Iceotope’s new Ku:l Micro DC solution enables many industry standard servers to be liquid cooled and deployed outside the data centre. The new solution is offered in two scalable configurations:

  • Ku:l Micro DC (Small) <5kW
    • Processing power – Up to 4x Lenovo SR670 servers
    • Compact footprint – 24U NetShelter
    • Integrated cooling includes 5U rack mount liquid to air heat rejection unit
    • Monitoring: EcoStruxure IT, Compute Out of Band Management Solution
    • Service: Full lifecycle – install / decommissioning
  • Ku:l Micro DC (Medium) 46kW+
    • Fully scalable
    • Heavy lift processing capability
    • Industry standard 48U NetShelter liquid-cooled enclosure
    • Heat Rejection
    • Monitoring
    • Service

Chassis-level Immersion – cools, protects and increases durability of IT

Using Iceotope’s fully serviceable Ku:l liquid-cooled chassis, servers are partially immersed in a small quantity of dielectric coolant precision delivered to hotspots. This means there is no front-to-back air cooling, no bottom-to-top immersion constraints and no physical space wasted.

By removing the need for fans or moving parts, service intervals are greatly increased allowing low-touch compute and near-silent operation in any location. Industry standard form factors allow maintenance to be carried out on-site with familiar ease and no mess. The Ku:l solution provides further unique value by completely isolating the critical IT from the environment with a perfectly sealed and resilient enclosure. This renders the IT impervious to dust, gases and humidity, enabling HPC in places that weren’t possible until now.

Ku:l Micro DC with full remote monitoring and management by Schneider’s EcoStruxure IT

The new micro data centres are optimised for use in remote locations and harsh, Edge environments with the inclusion of Schneider Electric’s EcoStruxure IT, cloud-based DCIM to enable remote monitoring and management capability. The vendor-neutral solution sets a new standard for proactive insights on critical assets that impact the health and availability of IT environments, with the ability to deliver actionable real-time recommendations to optimise infrastructure performance and mitigate risk.

As an additional option, Avnet can integrate a MaaXBoard IoT single board computer to enable RedFish-compliant, out of band management of the IT equipment even when the servers are powered down or have become unresponsive.

David Craig, CEO, Iceotope, said: “The infrastructure to provision Edge expansion will be installed where space provides, outside traditional data centres – we call this the Fluid Edge. Iceotope is dedicated to ensuring the durability, reliability, efficiency and long-term viability of Fluid Edge facilities, where air cooled approaches have a limited future. Partnering with Lenovo to bring the Ku:l Micro DC to life has accelerated our capability to provide a proven and warranty-backed, chassis-level immersion cooled HPC design solution to this expanding market.”

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