Micron Technology has announced it is leading the industry by validating and shipping its high-capacity monolithic 32GB DRAM die-based 128GB DDR5 RDIMM memory in speeds up to 5,600 MT/s on all leading server platforms.
Powered by Micron’s industry-leading 1β (1-beta) technology, the 128GB DDR5 RDIMM memory delivers more than 45% improved bit density, up to 22% improved energy efficiency and up to 16% lower latency over competitive 3DS through-silicon via (TSV) products.
Micron’s collaboration with industry leaders and customers has yielded broad adoption of these new high-performance, large-capacity modules across high-volume server CPUs. These high-speed memory modules were engineered to meet the performance needs of a wide range of mission-critical applications in data centres, including Artificial Intelligence (AI) and Machine Learning (ML), High-Performance Computing (HPC), in-memory databases (IMDBs) and efficient processing for multithreaded, multicore count general compute workloads.
Micron’s 128GB DDR5 RDIMM memory will be supported by a robust ecosystem including AMD, Hewlett Packard Enterprise (HPE), Intel, Supermicro, along with many others.
“With this latest volume shipment milestone, Micron continues to lead the market in providing high-capacity RDIMMs that have been qualified on all the major CPU platforms to our customers,” said Praveen Vaidyanathan, Vice President and General Manager of Micron’s Compute Products Group.
“AI servers will now be configured with Micron’s 24GB 8-high HBM3E for GPU-attached memory and Micron’s 128GB RDIMMs for CPU-attached memory to deliver the capacity, bandwidth and power-optimised infrastructure required for memory intensive workloads,” added Vaidyanathan.
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